The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9578750 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 21, 2017

Filed:

Dec. 05, 2013
Applicant:

Subtron Technology Co., Ltd., Hsinchu County, TW;

Inventor:

Shih-Hao Sun, Hsinchu County, TW;

Assignee:

Subtron Technology Co., Ltd., Hsinchu County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0097 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48472 (2013.01); H01L 2924/15311 (2013.01); H05K 1/186 (2013.01); H05K 3/4602 (2013.01); H05K 3/4682 (2013.01); H05K 2203/1536 (2013.01);
Abstract

A manufacturing of a package carrier includes the following steps. Two base metal layers are bonded together. Two supporting layers are laminated onto the base metal layers respectively. Two release metal films are disposed on the supporting layers respectively. Each release metal film includes a first metal film and a second metal film separable from each other. Two first patterned metal layers are formed on the release metal films respectively. Each first patterned metal layer includes a pad pattern. Two dielectric layers are formed on the release metal films respectively and cover the corresponding first patterned metal layers. Each dielectric layer has a conductive via connecting to the corresponding pad pattern. Two second patterned metal layers are formed on the dielectric layers respectively. Each second patterned metal layer at least covers the conductive via. The base metal layers are separated from each other to form two independent package carriers.


Find Patent Forward Citations

Sun, Shih-Hao. (2017). Package carrier and manufacturing method thereof (U.S. Patent No. 9578750). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9578750

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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