The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2017

Filed:

Sep. 08, 2015
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Taejin Yim, Suwon-si, KR;

Thomas Oszinda, Suwon-si, KR;

Byunghee Kim, Seoul, KR;

Sanghoon Ahn, Goyang-si, KR;

Naein Lee, Seoul, KR;

Keeyoung Jun, Seongnam-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76837 (2013.01); H01L 21/0217 (2013.01); H01L 21/0231 (2013.01); H01L 21/02164 (2013.01); H01L 21/02216 (2013.01); H01L 21/02222 (2013.01); H01L 21/02271 (2013.01); H01L 21/76814 (2013.01); H01L 21/76825 (2013.01); H01L 21/76826 (2013.01); H01L 21/76831 (2013.01); H01L 21/76843 (2013.01);
Abstract

A method of treating a porous dielectric layer includes preparing a substrate on which the porous dielectric layer including an opening and pores exposed by the opening is formed, supplying a first precursor onto the substrate to form a first sub-sealing layer sealing the exposed pores, and supplying a second precursor onto the first sub-sealing layer to form a second sub-sealing layer covering the first sub-sealing layer. Each of the first and second precursors includes silicon, and a molecular weight of the second precursor is smaller than that of the first precursor.


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