The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2017
Filed:
Nov. 14, 2013
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Inventors:
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05D 7/06 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
G05D 7/0658 (2013.01); H01L 21/67253 (2013.01); Y10T 137/0396 (2015.04); Y10T 137/7761 (2015.04); Y10T 137/86002 (2015.04); Y10T 137/86083 (2015.04); Y10T 137/87676 (2015.04); Y10T 137/87684 (2015.04);
Abstract
Embodiments of mechanisms for processing a wafer are provided. A method for processing a wafer includes creating an exhaust flow in a fluid conduit assembly that is connected to a process module used for processing the wafer. The method also includes detecting the exhaust pressure in the fluid conduit assembly. The method further includes determining whether the exhaust pressure meets a set point. In addition, the method includes regulating the exhaust flow if the exhaust pressure fails to meet the set point.