The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2017

Filed:

May. 10, 2016
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Shih-Yin Hsiao, Chiayi County, TW;

Ching-Chung Yang, Hsinchu, TW;

Tun-Jen Cheng, Hsinchu, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/338 (2006.01); H01L 27/11 (2006.01); H01L 21/266 (2006.01); H01L 21/027 (2006.01); H01L 21/265 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1116 (2013.01); H01L 21/0273 (2013.01); H01L 21/266 (2013.01); H01L 21/26513 (2013.01); H01L 21/26586 (2013.01); H01L 27/1104 (2013.01);
Abstract

A method of forming semiconductor devices. First, a substrate is provided, and a first implant area and a second implant area are defined in a mask pattern. Subsequently, a resist layer on the substrate is patterned using the mask pattern to form a first opening exposing the first implant area and a second opening to expose the second implant area. After that, an ion implantation process including a partial shadowing ion implant is processed, wherein the second implant area is implanted by the partial shadowing ion implant to a predetermined concentration, and the first implant area is substantially not implanted by the partial shadowing ion implant.


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