The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2017
Filed:
Sep. 29, 2011
Jesus Alfonso Castaneda, Los Angeles, CA (US);
Arya Reza Behzad, Poway, CA (US);
Ahmadreza Rofougaran, Newport Coast, CA (US);
Sam Ziqun Zhao, Irvine, CA (US);
Michael Boers, Irvine, CA (US);
Jesus Alfonso Castaneda, Los Angeles, CA (US);
Arya Reza Behzad, Poway, CA (US);
Ahmadreza Rofougaran, Newport Coast, CA (US);
Sam Ziqun Zhao, Irvine, CA (US);
Michael Boers, Irvine, CA (US);
Broadcom Corporation, Irvine, CA (US);
Abstract
Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.