The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2017
Filed:
Feb. 10, 2012
Chun-ting Kuo, Tainan, TW;
Kei-wei Chen, Tainan, TW;
Ying-lang Wang, Tien-Chung Village, TW;
Kuo-hsiu Wei, Tainan, TW;
Chun-Ting Kuo, Tainan, TW;
Kei-Wei Chen, Tainan, TW;
Ying-Lang Wang, Tien-Chung Village, TW;
Kuo-Hsiu Wei, Tainan, TW;
Abstract
Methods of thinning a plurality of semiconductor wafers and apparatuses for carrying out the same are disclosed. A grinding module within a set of grinding modules receives and grinds a semiconductor wafer. A polishing module receives the semiconductor wafer from the grinding module and polishes the wafer. The polishing module is configured to polish the semiconductor wafer in less time than the grinding module is configured to grind the corresponding wafer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile