The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2017

Filed:

Jan. 29, 2013
Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Kazuyoshi Tari, Naka, JP;

Mototaka Ishikawa, Naka, JP;

Keiji Shirata, Naka, JP;

Kenzo Nakamura, Naka, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01J 5/00 (2006.01); G01J 5/10 (2006.01); G01J 5/08 (2006.01); G01J 5/06 (2006.01); H05K 1/02 (2006.01); H01L 37/02 (2006.01); G01J 5/20 (2006.01); H01L 27/144 (2006.01); G03G 15/20 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G01J 5/10 (2013.01); G01J 5/0022 (2013.01); G01J 5/06 (2013.01); G01J 5/0803 (2013.01); H05K 1/0271 (2013.01); G01J 2005/103 (2013.01); G01J 2005/206 (2013.01); G03G 15/2039 (2013.01); G03G 2215/00772 (2013.01); H01L 27/144 (2013.01); H01L 37/02 (2013.01); H05K 1/189 (2013.01); H05K 2201/068 (2013.01); H05K 2201/09136 (2013.01); H05K 2201/09781 (2013.01);
Abstract

Provided is an infrared sensor which is capable of measuring a temperature of an object to be measured with high accuracy even when lead wires are connected to one side thereof. The infrared sensor includes an insulating film; a first and a second heat sensitive element which are provided on one face of the insulating film; a first and a second wiring film that are respectively connected to the first and the second heat sensitive element; an infrared reflecting film; a plurality of terminal electrodes; and a thermal resistance adjusting film which is provided on the other face of the insulating film, is in opposition to at least a portion of the longer one of the first or the second wiring film in wiring distance from the terminal electrodes, and is formed of a material with greater heat dissipation than the insulating film.


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