The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2017
Filed:
Sep. 27, 2013
Tanaka Kikinzoku Kogyo K.k., Chiyoda-ku, JP;
A School Corporation Kansai University, Osaka, JP;
Noriaki Nakamura, Tsukuba, JP;
Junichi Taniuchi, Tsukuba, JP;
Hitoshi Kubo, Tsukuba, JP;
Yuusuke Ohshima, Tsukuba, JP;
Tomoko Ishikawa, Tsukuba, JP;
Shoso Shingubara, Tsukuba, JP;
Fumihiro Inoue, Tsukuba, JP;
Tanaka Kikinzoku Kogyo K.K., Tokyo, JP;
Abstract
The present invention provides a method for treating a substrate that supports metal fine particles for forming a plating layer on a circuit pattern or TSVs in various substrates, in which further micronization treatment is enabled compared with the conventional methods, and the formation of a stable plating layer is enabled. The present invention is a method for treating a substrate, the method including bringing a substrate into contact with a colloidal solution containing metal particles in order to support the metal particles that serve as a catalyst for forming a plating layer on the substrate, in which the colloidal solution contains metal particles formed of Pd and having a particle size of 0.6 nm to 4.0 nm and a face-to-face dimension of the (111) plane of 2.254 Å or more. When an organic layer such as SAM is formed on a surface of the substrate before this treatment, the binding force of the Pd particles can be increased.