The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2017
Filed:
Jan. 21, 2015
Applicant:
Amkor Technology, Inc., Tempe, AZ (US);
Inventor:
Ah Ron Lee, Seoul, KR;
Assignee:
Amkor Technology, Inc., Tempe, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 3/40 (2006.01); H05K 3/00 (2006.01); H05K 3/06 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4007 (2013.01); H05K 3/007 (2013.01); H05K 1/115 (2013.01); H05K 3/064 (2013.01);
Abstract
In one embodiment, a method for forming an embedded trace substrate includes forming a conductive layer on a carrier. A dielectric film is provided on the conductive layer. Vias are formed in the dielectric film and extend to portions of the conductive layer. A conductive pattern is formed on the dielectric layer and is electrically connected to the conductive layer through the vias. The carrier is removed and portions of the conductive layer are selectively removed to provide a plurality of bumps pads configured to protrude outwardly from the dielectric layer.