The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2017
Filed:
Mar. 29, 2013
Applicant:
Ibiden Co., Ltd., Ogaki-shi, JP;
Inventors:
Assignee:
IBIDEN CO., LTD., Ogaki-shi, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/46 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 3/4694 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15192 (2013.01); H05K 3/3436 (2013.01); H05K 3/4644 (2013.01); H05K 2201/10159 (2013.01);
Abstract
A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer, a second insulation layer formed on the first insulation layer and the first conductive patterns and having an opening portion, a wiring structure accommodated in the opening portion of the second insulation layer and including an insulation layer and conductive patterns on the insulation layer, second conductive patterns formed on the second insulation layer; and a via conductor formed in the second insulation layer and connecting one of the first conductive patterns and one of the second conductive patterns.