The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Mar. 21, 2012
Applicants:

Ian Burke, Lake Forest, CA (US);

Jason Cook, Huntington Beach, CA (US);

Ahmad Khanifar, Laguna Hills, CA (US);

Inventors:

Ian Burke, Lake Forest, CA (US);

Jason Cook, Huntington Beach, CA (US);

Ahmad Khanifar, Laguna Hills, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 11/00 (2006.01); H01P 1/208 (2006.01); C23C 18/16 (2006.01); C23C 28/02 (2006.01); C25D 1/02 (2006.01); C25D 7/00 (2006.01);
U.S. Cl.
CPC ...
H01P 11/007 (2013.01); C23C 18/1653 (2013.01); C23C 18/1657 (2013.01); C23C 28/021 (2013.01); C23C 28/023 (2013.01); C25D 1/02 (2013.01); C25D 7/00 (2013.01); H01P 1/208 (2013.01); H01P 11/008 (2013.01);
Abstract

Embodiments provide a novel fabrication method and structure for reducing structural weight in radio frequency cavity filters and novel filter structure. The novel filter structure is fabricated by electroplating the required structure over a mold. The electrodeposited composite layer may be formed by several layers of metal or metal alloys with compensating thermal expansion coefficients. The first or the top layer is a high conductivity material or compound such as silver having a thickness of several times the skin-depth at the intended frequency of operation. The top layer provides the vital low loss performance and high Q-factor required for such filter structures while the subsequent compound layers provide the mechanical strength.


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