The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Jan. 20, 2014
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

John E. Barth, Jr., Williston, VT (US);

Kangguo Cheng, Schenectady, NY (US);

Bruce B. Doris, Brewster, NY (US);

Herbert L. Ho, New Windsor, NY (US);

Ali Khakifirooz, Mountain View, CA (US);

Babar A. Khan, Ossining, NY (US);

Shom Ponoth, Gaithersburg, MD (US);

Kern Rim, Yorktown Heights, NY (US);

Kehan Tian, Poughkeepsie, NY (US);

Reinaldo A. Vega, Wappingers Falls, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 29/06 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/94 (2006.01); H01L 21/283 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10879 (2013.01); H01L 21/283 (2013.01); H01L 21/76224 (2013.01); H01L 27/1087 (2013.01); H01L 27/10826 (2013.01); H01L 27/10829 (2013.01); H01L 27/10867 (2013.01); H01L 29/0653 (2013.01); H01L 29/41783 (2013.01); H01L 29/41791 (2013.01); H01L 29/6681 (2013.01); H01L 29/66181 (2013.01); H01L 29/785 (2013.01); H01L 29/945 (2013.01);
Abstract

Trench capacitors can be formed between lengthwise sidewalls of semiconductor fins, and source and drain regions of access transistors are formed in the semiconductor fins. A dummy gate structure is formed between end walls of a neighboring pair of semiconductor fins, and limits the lateral extent of raised source and drain regions that are formed by selective epitaxy. The dummy gate structure prevents electrical shorts between neighboring semiconductor fins. Gate spacers can be formed around gate structures and the dummy gate structures. The dummy gate structures can be replaced with dummy replacement gate structures or dielectric material portions, or can remain the same without substitution of any material. The dummy gate structures may consist of at least one dielectric material, or may include electrically floating conductive material portions.


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