The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Mar. 11, 2015
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Masaki Mizutani, Utsunomiya, JP;

Kenichiro Mori, Utsunomiya, JP;

Seiya Miura, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/66 (2006.01); H01L 21/768 (2006.01); H01L 23/544 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); H01L 21/76898 (2013.01); H01L 23/544 (2013.01); H01L 25/50 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54453 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The present invention provides a forming method of forming a through electrode, in a second substrate joined on a first substrate having an electrode pad, to electrically connect a pattern to be formed on the second substrate to the electrode pad, the method comprising steps of detecting a position of a first mark formed on the first substrate and a position of a second mark formed on the second substrate in a state in which the first substrate and the second substrate are joined, determining, based on the position of the first mark and the position of the second mark detected in the detecting, a point to form the through electrode in the second substrate so as to electrically connect the pattern to the electrode pad, and forming the through electrode at the determined point.


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