The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Sep. 21, 2015
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Kosuke Ogasawara, Portland, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31116 (2013.01); H01L 21/31122 (2013.01); H01L 21/31138 (2013.01); H01L 21/31144 (2013.01);
Abstract

Embodiments of the invention describe a method for controlling etching in pitch doubling. According to one embodiment, the method includes receiving a substrate having a pattern thereon defined by spacers formed on sidewalls of a plurality mandrels, and transferring the pattern defined by the spacers into the substrate using a plasma etch process that etches the mandrels and the substrate, the transferring forming first recessed features in the substrate below the mandrels and second recessed features in the substrate between the mandrels, where the plasma etch process utilizes an etching gas containing Ogas, and the relative amount of Ogas in the etching gas is selected to control the depth of the first recessed features relative to the depth of second recessed features. According to another embodiment, the substrate contains a mask layer thereon and a pattern on the mask layer.


Find Patent Forward Citations

Loading…