The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Jan. 30, 2014
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Mitsuya Inoue, Nirasaki, JP;

Makoto Takado, Oshu, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/52 (2006.01); G05D 16/00 (2006.01); C23C 16/448 (2006.01); C23C 16/455 (2006.01); G05D 7/06 (2006.01);
U.S. Cl.
CPC ...
G05D 16/00 (2013.01); C23C 16/4481 (2013.01); C23C 16/45561 (2013.01); G05D 7/0676 (2013.01); Y10T 137/0379 (2015.04); Y10T 137/7758 (2015.04);
Abstract

A raw material gas supply method for use in a film forming apparatus which forms a film on a substrate, includes supplying a carrier gas to a gas phase zone defined inside a raw material container accommodating a liquid or solid raw material, vaporizing the raw material, supplying a raw material gas containing the vaporized raw material from the raw material container to the film forming apparatus via a raw material gas supply path, measuring a flow rate of the vaporized raw material flowing through the raw material gas supply path, comparing the flow rate of the vaporized raw material obtained by the flow rate measurement unit with a predetermined target value, and controlling an internal pressure of the raw material container to be increased when the flow rate is higher than the predetermined target value, and to be decreased when the is lower than the predetermined target value.


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