The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2017

Filed:

Mar. 02, 2015
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Yasuhiko Kusama, Nagano, JP;

Hideyuki Tako, Nagano, JP;

Kenji Kawai, Nagano, JP;

Fumihisa Miyasaka, Nagano, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H05K 3/4697 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15313 (2013.01); H05K 3/4602 (2013.01); H05K 2201/09972 (2013.01);
Abstract

A wiring substrate includes a core layer having a hole penetrating therethrough in a thickness direction thereof, and having a projecting part projecting from an inner wall of the hole toward an inner space of the hole, the projecting part being situated at a border that divides a plurality of areas in the hole, a plurality of electronic components disposed in the areas, respectively, the electronic components being arranged at a spaced interval with the projecting part therebetween, and a resin layer filling the hole and supporting the electronic components, wherein a thickness of the projecting part in the thickness direction of the core layer decreases toward a tip of the projecting part.


Find Patent Forward Citations

Loading…