The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2017

Filed:

Oct. 06, 2015
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventor:

Tomoharu Fujii, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/11 (2006.01); H01L 23/34 (2006.01); H05K 1/14 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H01L 23/34 (2013.01); H05K 1/144 (2013.01); H05K 3/4608 (2013.01); H05K 3/4697 (2013.01); H01L 2924/0002 (2013.01); H05K 1/181 (2013.01); H05K 1/183 (2013.01); H05K 2201/10037 (2013.01);
Abstract

A package includes a metal core substrate, a first insulation layer formed along a periphery of a first surface of the metal core substrate, the first surface of the metal core substrate being exposed at an inner side of the first insulation layer, a second insulation layer formed along at least a periphery of a second surface of the metal core substrate, a first through-electrode penetrating the second insulation layer at a first part of the periphery of the metal core substrate, and a second through-electrode penetrating the first insulation layer, the metal core substrate and the second insulation layer at a second part of the periphery of the metal core substrate, the second through-electrode being electrically insulated from the metal core substrate via an insulation member.


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