The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2017

Filed:

May. 22, 2015
Applicant:

Infineon Technologies Dresden Gmbh, Dresden, DE;

Inventors:

Robert Strenz, Radebeul, DE;

Mayk Roehrich, Dresden, DE;

Wolfram Langheinrich, Dresden, DE;

John Power, Tainan, TW;

Danny Shum, Tainan, TW;

Martin Stiftinger, Stockdorf, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/115 (2006.01); H01L 21/8247 (2006.01); H01L 21/336 (2006.01); H01L 21/8239 (2006.01); H01L 21/28 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11548 (2013.01); H01L 21/28273 (2013.01); H01L 21/28282 (2013.01); H01L 21/76895 (2013.01); H01L 21/76897 (2013.01); H01L 27/11524 (2013.01); H01L 27/11529 (2013.01); H01L 27/11534 (2013.01); H01L 27/11556 (2013.01); H01L 29/4234 (2013.01); H01L 29/42324 (2013.01); H01L 29/66825 (2013.01); H01L 29/66833 (2013.01);
Abstract

A method for processing a carrier accordance with various embodiments may include: forming a structure over the carrier, the structure including at least two adjacent structure elements arranged at a first distance between the same; depositing a spacer layer over the structure, wherein the spacer layer may be deposited having a thickness greater than half of the first distance, wherein the spacer layer may include electrically conductive spacer material; removing a portion of the spacer layer, wherein spacer material of the spacer layer may remain in a region between the at least two adjacent structure elements; and electrically contacting the remaining spacer material.


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