The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2017
Filed:
Mar. 22, 2012
Kazuyuki Tamura, Tokyo, JP;
Takashi Akutsu, Tokyo, JP;
Yuki Eto, Tokyo, JP;
Tomohide Hukuzaki, Osaka, JP;
Kazuyuki Tamura, Tokyo, JP;
Takashi Akutsu, Tokyo, JP;
Yuki Eto, Tokyo, JP;
Tomohide Hukuzaki, Osaka, JP;
LINTEC Corporation, Tokyo, JP;
Arakawa Chemical Industries, LTD, Osaka, JP;
Abstract
To prevent bumps on the circuit side of a bump-bearing wafer from getting crushed when grinding the back side of said wafer while protecting the circuit side with a surface-protection sheet, and also to minimize the formation of dimples and cracks on the side being ground. [Solution] This base film for a pressure-sensitive adhesive sheet bonded to a semiconductor wafer comprises: (A) a layer obtained by using energy rays to cure a formulation containing a urethane (meth)acrylate oligomer and a thiol-group-containing compound; and (B) a layer comprising a thermoplastic resin.