The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2017
Filed:
Oct. 18, 2012
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Martin Standing, Villach, AT;
Milko Paolucci, Villach, AT;
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 23/498 (2006.01); H01L 23/367 (2006.01); H01L 25/16 (2006.01); H05K 1/02 (2006.01); H01L 23/36 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 23/36 (2013.01); H01L 23/367 (2013.01); H01L 25/16 (2013.01); H05K 1/0209 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H05K 1/0203 (2013.01); H05K 1/185 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/1053 (2013.01); H05K 2201/10636 (2013.01);
Abstract
Representative implementations of devices and techniques provide improved thermal performance of a chip die disposed within a layered printed circuit board (PCB). Passive components may be strategically located on one or more surfaces of the PCB. The passive components may be arranged to conduct heat generated by the chip die away from the chip die.