The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2017
Filed:
Dec. 22, 2014
Applicant:
Triquint Semiconductor, Inc., Hillsboro, OR (US);
Inventors:
Tarak A. Railkar, Plano, TX (US);
Deep C. Dumka, Richardson, TX (US);
Assignee:
Qorvo US, Inc., Greensboro, NC (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/34 (2006.01); H01L 21/78 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 21/4882 (2013.01); H01L 21/78 (2013.01); H01L 23/3735 (2013.01); H01L 24/83 (2013.01); H01L 23/373 (2013.01); H01L 23/3731 (2013.01); H01L 23/3732 (2013.01); H01L 23/3736 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12042 (2013.01);
Abstract
Methods and apparatuses for forming a package for high-power semiconductor devices are disclosed herein. A package may include a plurality of distinct thermal spreader layers disposed between a die and a metal carrier. Other embodiments are described and claimed.