The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2017

Filed:

Feb. 11, 2015
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Yong-Yan Lu, Hsin-Chu, TW;

Chia-Wei Soong, Longtan, TW;

Hou-Yu Chen, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 21/8238 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66795 (2013.01); H01L 21/823821 (2013.01); H01L 29/785 (2013.01); H01L 29/7849 (2013.01);
Abstract

A semiconductor device and a method of forming the same are disclosed. The method includes receiving a substrate having a fin projecting through an isolation structure over the substrate; etching a portion of the fin, resulting in a trench; forming a doped material layer on sidewalls of the trench; and growing at least one epitaxial layer in the trench. The method further includes exposing a first portion of the at least one epitaxial layer over the isolation structure; and performing an annealing process, thereby driving dopants from the doped material layer into a second portion of the at least one epitaxial layer. The first portion of the at least one epitaxial layer provides a strained channel for the semiconductor device and the second portion of the at least one epitaxial layer provides a punch-through stopper.


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