The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2017

Filed:

Dec. 04, 2014
Applicant:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Inventors:

Toshihiro Ohki, Hadano, JP;

Lei Zhu, Atsugi, JP;

Naoya Okamoto, Isehara, JP;

Yuichi Minoura, Zama, JP;

Shirou Ozaki, Yamato, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/205 (2006.01); H01L 29/423 (2006.01); H01L 29/49 (2006.01); H01L 29/778 (2006.01); H01L 29/78 (2006.01); H01L 29/10 (2006.01); H01L 29/20 (2006.01); H01L 29/51 (2006.01); H01L 29/08 (2006.01);
U.S. Cl.
CPC ...
H01L 29/205 (2013.01); H01L 29/1045 (2013.01); H01L 29/4236 (2013.01); H01L 29/4983 (2013.01); H01L 29/66462 (2013.01); H01L 29/66704 (2013.01); H01L 29/7786 (2013.01); H01L 29/7825 (2013.01); H01L 29/0878 (2013.01); H01L 29/2003 (2013.01); H01L 29/517 (2013.01);
Abstract

A semiconductor device includes: a first semiconductor layer which is formed over a substrate and is formed from a nitride semiconductor; a second semiconductor layer which is formed over the first semiconductor layer and is formed from a nitride semiconductor; a third semiconductor layer which is formed over the second semiconductor layer and is formed from a nitride semiconductor; a source electrode and a drain electrode which are formed over the third semiconductor layer; an opening which is formed in the second semiconductor layer and the third semiconductor layer between the source electrode and the drain electrode; an insulating layer which is formed on a side surface and a bottom surface of the opening; and a gate electrode which is formed in the opening through the insulating layer.


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