The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2017

Filed:

Jun. 08, 2015
Applicant:

Macronix International Co., Ltd., Hsinchu, TW;

Inventor:

Lo-Yueh Lin, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/3213 (2006.01); H01L 27/115 (2006.01); H01L 21/321 (2006.01); H01L 21/28 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 21/28282 (2013.01); H01L 21/32115 (2013.01); H01L 21/32133 (2013.01);
Abstract

Provided is a fabricating method of a semiconductor device, including the following. Fin structures are formed on a substrate, and the adjacent fin structures have an opening therebetween. A conductive material layer is formed to cover the fin structures and fill the opening. The conductive material layer and the fin structures are patterned to form a mesh structure. The mesh structure includes first strips extending in a first direction and second strips extending in a second direction. The first strips and the second strips intersect each other, and the mesh structure has holes. The first strips are located on the substrate at positions corresponding to the fin structures. The second strips are located on the substrate, and the conductive material layer in the second strips spans the fin structures. The hole is formed in the opening and surrounded by the first strips and the second strips.


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