The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2017
Filed:
Sep. 15, 2015
Applicant:
Globalfoundries Inc., Grand Cayman, KY;
Inventors:
Luke England, Saratoga Springs, NY (US);
Rahul Agarwal, Waterford, NY (US);
Assignee:
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/03 (2013.01); H01L 23/481 (2013.01); H01L 24/06 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/0401 (2013.01); H01L 2924/35 (2013.01);
Abstract
A method of forming a network of RDL lines on the backside of a thinned TSV die to control warpage and the resulting device are provided. Embodiments include providing a thinned TSV die of a 3D IC stack, the thinned TSV die having a front side and a back side; forming a plurality of RDL lines across the backside of the die; and forming a plurality of UBM structures across the backside of the die.
England, Luke. (2017). Wafer backside redistribution layer warpage control (U.S. Patent No. 9553058). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9553058
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile