The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2017
Filed:
Apr. 23, 2015
Applicant:
Soitec, Crolles, FR;
Inventors:
Mariam Sadaka, Austin, TX (US);
Ionut Radu, Crolles, FR;
Assignee:
Soitec, Bernin, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/762 (2006.01); H01L 21/20 (2006.01); H01L 21/683 (2006.01); H01L 21/768 (2006.01); H01L 25/00 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76254 (2013.01); H01L 21/2007 (2013.01); H01L 21/6835 (2013.01); H01L 21/76898 (2013.01); H01L 23/5384 (2013.01); H01L 23/562 (2013.01); H01L 24/28 (2013.01); H01L 24/80 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 24/98 (2013.01); H01L 25/50 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/94 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68377 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/0362 (2013.01); H01L 2224/03616 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/056 (2013.01); H01L 2224/05009 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05687 (2013.01); H01L 2224/08121 (2013.01); H01L 2224/08146 (2013.01); H01L 2224/0903 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/27444 (2013.01); H01L 2224/27616 (2013.01); H01L 2224/29187 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/80 (2013.01); H01L 2224/802 (2013.01); H01L 2224/80006 (2013.01); H01L 2224/80011 (2013.01); H01L 2224/80121 (2013.01); H01L 2224/80203 (2013.01); H01L 2224/80357 (2013.01); H01L 2224/80805 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2224/80905 (2013.01); H01L 2224/83 (2013.01); H01L 2224/832 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83011 (2013.01); H01L 2224/83022 (2013.01); H01L 2224/83121 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83205 (2013.01); H01L 2224/83805 (2013.01); H01L 2224/83896 (2013.01); H01L 2224/92 (2013.01); H01L 2224/9211 (2013.01); H01L 2224/94 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/00 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/05042 (2013.01); H01L 2924/05442 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/3512 (2013.01);
Abstract
Methods of fabricating semiconductor structures include implanting atom species into a carrier die or wafer to form a weakened region within the carrier die or wafer, and bonding the carrier die or wafer to a semiconductor structure. The semiconductor structure may be processed while using the carrier die or wafer to handle the semiconductor structure. The semiconductor structure may be bonded to another semiconductor structure, and the carrier die or wafer may be divided along the weakened region therein. Bonded semiconductor structures are fabricated using such methods.