The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2017

Filed:

Oct. 28, 2014
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Masashi Shimoyama, Tokyo, JP;

Masamichi Tamura, Tokyo, JP;

Yuji Araki, Tokyo, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 21/16 (2006.01); C25D 3/60 (2006.01); C25D 21/12 (2006.01); C25D 21/18 (2006.01); C25D 17/00 (2006.01); C25D 17/06 (2006.01);
U.S. Cl.
CPC ...
C25D 21/16 (2013.01); C25D 3/60 (2013.01); C25D 17/002 (2013.01); C25D 21/12 (2013.01); C25D 21/18 (2013.01); C25D 17/001 (2013.01); C25D 17/06 (2013.01);
Abstract

An Sn alloy plating apparatus is disclosed which can relatively easily perform control of an Sn alloy plating solution, including control of the Sn ion concentration and the acid concentration of the plating solution. The Sn alloy plating apparatus includes: a plating bath configured to hold therein an Sn alloy plating solution in which an insoluble anode a the substrate are to be disposed opposite each other; a plating-solution circulation line configured to circulate the Sn alloy plating solution in the plating bath; an Sn supply reservoir configured to draw a part of the Sn alloy plating solution from the plating-solution circulation line, perform electrolysis in a presence of the Sn alloy plating solution to replenish the Sn alloy plating solution with Sn ions and an acid that stabilizes Sn ions, and return the Sn alloy plating solution that has been replenished with the Sn ions to the plating bath; and a dialysis unit configured to draw a part of the Sn alloy plating solution from the plating-solution circulation line, remove the acid from the Sn alloy plating solution, and then return the Sn alloy plating solution to the plating bath.


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