The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2017
Filed:
Jul. 20, 2015
Applicant:
X-celeprint Limited, Cork, IE;
Inventors:
Christopher Bower, Raleigh, NC (US);
Matthew Meitl, Durham, NC (US);
David Gomez, Durham, NC (US);
Salvatore Bonafede, Chapel Hill, NC (US);
David Kneeburg, Durham, NC (US);
Assignee:
X-Celeprint Limited, Cork, IE;
Primary Examiner:
Int. Cl.
CPC ...
B41F 16/00 (2006.01); H01L 21/3065 (2006.01); H01L 21/52 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); B41K 3/12 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01); B25J 15/00 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
B41F 16/00 (2013.01); B25J 15/00 (2013.01); B41K 3/12 (2013.01); H01L 21/3065 (2013.01); H01L 21/52 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/67103 (2013.01); H01L 21/683 (2013.01); H01L 21/6835 (2013.01); H01L 23/293 (2013.01); H01L 23/3171 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); H01L 25/50 (2013.01); H01L 31/1892 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68377 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75315 (2013.01); H01L 2224/83001 (2013.01); H01L 2224/832 (2013.01); H01L 2224/83011 (2013.01); H01L 2224/83013 (2013.01); H01L 2224/83024 (2013.01); H01L 2224/83894 (2013.01); H01L 2224/83895 (2013.01); H01L 2924/1032 (2013.01); H01L 2924/1034 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10328 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/10332 (2013.01); H01L 2924/10335 (2013.01); H01L 2924/10336 (2013.01); H01L 2924/10337 (2013.01); H01L 2924/10338 (2013.01);
Abstract
In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.