The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2017

Filed:

Oct. 09, 2015
Applicant:

Dai Nippon Printing Co., Ltd., Tokyo, JP;

Inventors:

Yoshinori Hirobe, Tokyo, JP;

Yutaka Matsumoto, Tokyo, JP;

Masato Ushikusa, Tokyo, JP;

Toshihiko Takeda, Tokyo, JP;

Katsunari Obata, Tokyo, JP;

Hiroyuki Nishimura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/04 (2006.01); H01L 51/00 (2006.01); C23C 14/24 (2006.01); C23C 14/04 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0011 (2013.01); C23C 14/042 (2013.01); C23C 14/24 (2013.01); C23C 16/042 (2013.01); H01L 51/56 (2013.01); Y10T 29/49826 (2015.01);
Abstract

A method for producing a multiple-surface imposition vapor deposition mask enhances definition and reduces weight even when a size is increased. Each of multiple masks in an open space in a frame is configured by a metal mask having a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows. In formation of the plurality of masks, after each of the metal masks and a resin film material for producing the resin mask are attached to the frame, the resin film material is processed, and the openings corresponding to the pattern to be produced by vapor deposition are formed in a plurality of rows lengthwise and crosswise, whereby the multiple-surface imposition vapor deposition mask of the above described configuration is produced.


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