The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2017

Filed:

Dec. 08, 2014
Applicant:

Oxford Instruments Analytical Oy, Espoo, FI;

Inventor:

Veikko Kämäräinen, Helsinki, FI;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01T 1/24 (2006.01); H01J 37/244 (2006.01); H01L 31/02 (2006.01); H01L 31/0203 (2014.01); H01L 31/024 (2014.01); G01J 1/44 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02002 (2013.01); G01J 1/44 (2013.01); G01T 1/24 (2013.01); H01J 37/244 (2013.01); H01L 31/0203 (2013.01); H01L 31/024 (2013.01); H01L 31/18 (2013.01); G01J 2001/4446 (2013.01); H01J 2237/2442 (2013.01);
Abstract

A semiconductor radiation detector comprises a detector chip having a front side and a back side, and a support plate on the back side of the detector chip, having electric connections with said detector chip. A base plate has a thermoelectric cooler attached to it and contact pins protruding from the base plate towards said detector chip. A bonding plate is on an opposite side of said thermoelectric cooler than said base plate, and first wire bonded connections go between said contact pins and said bonding plate. A joint plate is between said bonding plate and said support plate, and electric connections between said support plate and said bonding plate go through said joint plate.


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