The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2017
Filed:
May. 15, 2015
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Ming Hsien Tsai, New Taipei, TW;
Hsieh-Hung Hsieh, Tapei, TW;
Tzu-Jin Yeh, Hsinchu, TW;
Chewn-Pu Jou, Hsinchu, TW;
Sa-Lly Liu, HsinChu, TW;
Fu-Lung Hsueh, Koahsiung, TW;
Abstract
The three dimensional (3D) circuit includes a first tier including a semiconductor substrate, a second tier disposed adjacent to the first tier, a three dimensional inductor including an inductive element portion, the inductive element portion including a conductive via extending from the first tier to a dielectric layer of the second tier. The 3D circuit includes a ground shield surrounding at least a portion of the conductive via. In some embodiments, the ground shield includes a hollow cylindrical cage. In some embodiments, the 3D circuit is a low noise amplifier.