The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2017
Filed:
Feb. 23, 2015
Applicant:
Freescale Semiconductor, Inc., Austin, TX (US);
Inventor:
Trent S. Uehling, Austin, TX (US);
Assignee:
NXP USA, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); C23C 14/34 (2006.01); H01L 23/00 (2006.01); F28F 3/04 (2006.01); H01L 23/367 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/373 (2013.01); C23C 14/34 (2013.01); F28F 3/04 (2013.01); H01L 21/4871 (2013.01); H01L 23/367 (2013.01); H01L 23/3736 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01);
Abstract
The present disclosure provides embodiments for a semiconductor structure including a heat spreader that includes a graphene grid having a first major surface and a second major surface opposite the first major surface. The graphene grid has a plurality of holes, each hole having a first opening in the first major surface and a second opening in the second major surface. The heat spreader also includes a first copper portion covering the first major surface of the graphene grid, a second copper portion covering the second major surface of the graphene grid, and a plurality of copper vias filling the plurality of holes.