The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2017
Filed:
Feb. 09, 2012
Weifang Miao, Columbus, OH (US);
David B. Smathers, Columbus, OH (US);
Eugene Y. Ivanov, Grove City, OH (US);
Erich Theado, Columbus, OH (US);
Robert S. Bailey, Grove City, OH (US);
Jeff Hart, Columbus, OH (US);
Weifang Miao, Columbus, OH (US);
David B. Smathers, Columbus, OH (US);
Eugene Y. Ivanov, Grove City, OH (US);
Erich Theado, Columbus, OH (US);
Robert S. Bailey, Grove City, OH (US);
Jeff Hart, Columbus, OH (US);
Tosoh SMD, Inc., Grove City, OH (US);
Abstract
A method of making a diffusion bonded sputter target assembly is provided. A target blank comprising a first metal or alloy has a first surface defining a sputtering surface and a second surface. A second metal or alloy is placed around the target blank. A backing plate is provided adjacent the second metal or alloy that is positioned alongside of the second target surface. This assembly is then diffusion bonded, and a portion of the second metal overlying the sputtering surface of the target is removed to expose the target sputtering surface. W target or W alloy target/Ti or Ti alloy backing plate assemblies are provided with an Al interlayer positioned intermediate the W or W alloy target and backing plate. The assembly has a bond strength exceeding 50 MPa.