The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2017

Filed:

May. 25, 2015
Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Zheng Zou, Singapore, SG;

Alex See, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 43/08 (2006.01); H01L 43/02 (2006.01); H01L 43/12 (2006.01); H01L 27/22 (2006.01);
U.S. Cl.
CPC ...
H01L 43/02 (2013.01); H01L 27/222 (2013.01); H01L 43/08 (2013.01); H01L 43/12 (2013.01);
Abstract

A method of forming high density contact array is disclosed. The method includes providing a first dielectric layer and forming a hard mask stack over the first dielectric layer. The hard mask stack includes first, second and third hard mask layers. The first and second hard mask layers are processed to form high density array of hard mask stack structures using a double patterning process. The hard mask stack structures include patterned first and second hard mask layers having a first width F. The width of the patterned second hard mask layers is reduced to a second width Fto form high density array of hard mask posts. A fourth hard mask layer is formed over the third hard mask layer and surrounding the hard mask posts. The hard mask posts and portions of the third hard mask layer and first dielectric layer underlying the hard mask posts are removed to form high density contact hole array.


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