The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2017

Filed:

Aug. 06, 2014
Applicant:

Dowa Electronics Materials Co., Ltd., Tokyo, JP;

Inventors:

Masatoshi Iwata, Akita, JP;

Yoshikazu Ooshika, Kamisato-machi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/06 (2010.01); H01L 33/12 (2010.01); H01L 33/32 (2010.01); H01L 33/00 (2010.01); H01L 21/02 (2006.01); C30B 29/40 (2006.01); C30B 29/68 (2006.01); H01S 5/343 (2006.01); H01L 33/04 (2010.01);
U.S. Cl.
CPC ...
H01L 33/06 (2013.01); C30B 29/403 (2013.01); C30B 29/68 (2013.01); H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01L 21/02458 (2013.01); H01L 21/02507 (2013.01); H01L 21/02576 (2013.01); H01L 33/007 (2013.01); H01L 33/04 (2013.01); H01L 33/12 (2013.01); H01L 33/32 (2013.01); H01L 33/325 (2013.01); H01S 5/34333 (2013.01); H01S 2301/173 (2013.01);
Abstract

A III nitride semiconductor epitaxial substrate having more excellent surface flatness is provided, in which the problems of crack formation and the double peaks in the shape of the EL spectrum are mitigated by employing appropriate conditions for Si doping on an AlN layer on a substrate; a III nitride semiconductor light emitting device; and methods of producing the same. A III nitride semiconductor epitaxial substrate has a substrate of which at least a surface portion is made of AlN, an undoped AlN layer formed on the substrate, an Si-doped AlN buffer layer formed on the undoped AlN layer, and a superlattice laminate formed on the Si-doped AlN buffer layer. The Si-doped AlN buffer layer has an Si concentration of 2.0×10/cmor more and a thickness of 4 nm to 10 nm.


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