The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2017

Filed:

Sep. 29, 2015
Applicant:

Globalfoundries Inc., Grand Cayman, KY (US);

Inventors:

Xusheng Wu, Ballston Lake, NY (US);

Konstantin G. Korablev, Saratoga Springs, NY (US);

Shesh Mani Pandey, Clifton Park, NY (US);

Manfred Eller, Beacon, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/82 (2006.01); H01L 27/088 (2006.01); H01L 21/8234 (2006.01); H01L 29/10 (2006.01); H01L 21/02 (2006.01); H01L 21/3105 (2006.01); H01L 21/311 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0886 (2013.01); H01L 21/02282 (2013.01); H01L 21/31055 (2013.01); H01L 21/31133 (2013.01); H01L 21/823431 (2013.01); H01L 21/823437 (2013.01); H01L 29/1083 (2013.01); H01L 29/66545 (2013.01);
Abstract

A method of forming fins and the resulting fin-shaped field effect transistors (finFET) are provided. Embodiments include forming silicon (Si) fins over a substrate; forming a first metal over each of the Si fins; forming an isolation material over the first metal; removing an upper portion of the isolation material to expose and upper portion of the first metal; removing the upper portion of the first metal to expose an upper portion of each Si fin; removing the isolation material after removing the upper portion of the first metal; and forming a second metal over the first metal and the upper portion of the Si fins.


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