The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2017
Filed:
Nov. 26, 2013
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventors:
Satoru Mori, Okegawa, JP;
Souhei Nonaka, Sanda, JP;
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/20 (2006.01); H01J 37/34 (2006.01); H05K 3/02 (2006.01); H05K 1/09 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3426 (2013.01); H05K 3/022 (2013.01); H05K 1/09 (2013.01); H05K 3/06 (2013.01); H05K 2201/0317 (2013.01); H05K 2201/0338 (2013.01); Y10T 428/1291 (2015.01);
Abstract
A sputtering target for forming protective film according to the invention is used to form protective film on one surface or both surfaces of a Cu wiring film, and includes 8.0 to 11.0% by mass of Al, 3.0 to 5.0% by mass of Fe, 0.5 to 2.0% by mass of Ni and 0.5 to 2.0% by mass of Mn with a remainder of Cu and inevitable impurities. In addition, a laminated wiring film includes a Cu wiring film and protective film formed on one surface or both surfaces of the Cu wiring film, and the protective film is formed by using the above sputtering target.