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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9540547 B1

PDFFull Text
Date of Patent:
Jan. 10, 2017

Filed:

Dec. 12, 2014

Composition for forming adhesive layer of dicing film, and dicing film

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Young Kook Kim, Daejeon, KR;

Se Ra Kim, Daejeon, KR;

Hee Jung Kim, Daejeon, KR;

Jung Ho Jo, Daejeon, KR;

Kwang Joo Lee, Daejeon, KR;

Jung Hak Kim, Daejeon, KR;

Seung Hee Nam, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:

Rothwell, Figg, Ernst & Manbeck, P.C.

Primary Examiner:

Daniel Shook

Int. Cl.
CPC ...
C09J 11/08 (2006.01); H01L 21/26 (2006.01); H01L 21/78 (2006.01); C09J 133/00 (2006.01); C09J 7/02 (2006.01); C09J 5/00 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
C09J 11/08 (2013.01); C09J 5/00 (2013.01); C09J 7/02 (2013.01); C09J 133/00 (2013.01); H01L 21/26 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 24/94 (2013.01); C09J 2201/128 (2013.01); C09J 2201/606 (2013.01); C09J 2203/326 (2013.01); C09J 2205/302 (2013.01); C09J 2205/31 (2013.01); C09J 2433/00 (2013.01); C09J 2463/00 (2013.01); C09J 2475/00 (2013.01); C09J 2483/00 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/92 (2013.01); H01L 2221/68336 (2013.01); H01L 2221/68377 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/271 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83204 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/92 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/94 (2013.01); H01L 2924/3512 (2013.01);
Abstract

There are provided a composition for forming an adhesive layer of a dicing film including: a silicon compound oil including at least one reactive functional group; an adhesive binder; and a photoinitiator, wherein a weight ratio of the silicon compound oil including at least one reactive functional group to the adhesive binder is 0.01% to 4.5%, a dicing film including an adhesive layer including the composition, a dicing die bonding film including the dicing film, and a method for dicing a semiconductor wafer using the dicing die bonding film.

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