The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2017

Filed:

Jan. 15, 2015
Applicant:

Namics Corporation, Niigata-shi, Niigata, JP;

Inventors:

Raymond Dietz, Amesbury, MA (US);

Maciej Patelka, Salem, MA (US);

Cathy Shaw Trumble, Barrington, NH (US);

Noriyuki Sakai, Salem, MA (US);

Hiroshi Yamaguchi, Niigata, JP;

Assignee:

NAMICS CORPORATION, Niigata-shi, Niigata, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 8/24 (2006.01); H01L 23/00 (2006.01); C09J 9/02 (2006.01); C03C 4/14 (2006.01); C03C 3/12 (2006.01); H01B 1/16 (2006.01);
U.S. Cl.
CPC ...
C03C 8/24 (2013.01); C03C 3/122 (2013.01); C03C 3/125 (2013.01); C03C 3/127 (2013.01); C03C 4/14 (2013.01); C09J 9/02 (2013.01); H01B 1/16 (2013.01); H01L 24/83 (2013.01); C03C 2204/00 (2013.01); C03C 2205/00 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83948 (2013.01); H01L 2924/10272 (2013.01);
Abstract

A conductive paste including (A) conductive particles, (B) a glass frit containing substantially no lead, arsenic, tellurium, and antimony, and (C) a solvent. The glass frit (B) has a remelting temperature of 320 to 360° C., wherein the remelting temperature is indicated by a peak top of at least one endothermic peak having an endotherm of 20 J/g or more in a DSC curve as measured by a differential scanning calorimeter. The conductive paste can also include at least one metal oxide (D) selected from the group consisting of tin oxide, zinc oxide, indium oxide, and copper oxide. The glass frit (B) can further include (B-1) AgO, (B-2) VO, and (B-3) MoO. The conductive paste can achieve binding at a relatively low temperature (such as 370° C. or lower) and maintains a bond strength at a relatively high temperature (such as 300 to 360° C.).


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