The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2017
Filed:
Feb. 20, 2015
Applicant:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Inventors:
Hideki Yumoto, Nagano, JP;
Yoichi Harayama, Nagano, JP;
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3484 (2013.01); H01L 21/4853 (2013.01); H01L 23/49816 (2013.01); H01L 2924/0002 (2013.01); H05K 1/111 (2013.01); H05K 3/3489 (2013.01); H05K 2201/0162 (2013.01); H05K 2203/041 (2013.01); H05K 2203/1173 (2013.01);
Abstract
A wiring substrate includes an insulating layer and a pad exposed from the insulating layer. An outermost surface of the insulating layer is modified to have a hydrophobic property by being stamped with silicone.