The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2017
Filed:
Dec. 12, 2013
Shinko Electric Industries Co., Ltd., Nagano-ken, JP;
Hiroharu Yanagisawa, Nagano, JP;
Kentaro Kaneko, Nagano, JP;
Kazuhiro Oshima, Nagano, JP;
Junichi Nakamura, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano-ken, JP;
Abstract
A wiring substrate includes a first wiring layer with a wiring pattern and a metal foil. A first insulating layer includes a first through hole having a first end facing the metal foil and a second end. A second wiring layer includes a first opening having a diameter smaller than the second end. A second insulating layer includes a second through hole having a third end facing the wiring pattern and a fourth end. A third wiring layer includes a second opening having a diameter smaller than the fourth end. A first via is filled in the first opening, the first through hole, and a first recess, in the metal foil, having a diameter greater than the first end. A second via is filled in the second opening, the second through hole, and a second recess, in the wiring pattern, having a diameter greater than the third end.