The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2017

Filed:

Aug. 04, 2014
Applicant:

Chao-min Wang, Hsinchu County, TW;

Inventor:

Chao-Min Wang, Hsinchu County, TW;

Assignee:

SUBTRON TECHNOLOGY CO., LTD., Hsinchu County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/84 (2006.01); H05K 1/03 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0313 (2013.01); H01L 21/48 (2013.01); H01L 23/498 (2013.01); H05K 1/0298 (2013.01); H05K 1/114 (2013.01); H05K 1/115 (2013.01); H05K 3/007 (2013.01); H05K 3/46 (2013.01); H01L 2924/15151 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/035 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/09063 (2013.01); H05K 2203/0214 (2013.01); H05K 2203/1178 (2013.01); Y10T 156/10 (2015.01);
Abstract

A substrate structure is provided. The substrate structure includes a substrate and a carrier. The substrate includes a first through hole, a first surface and a second surface opposite to the first surface. The first through hole penetrates the substrate for connecting the first surface and the second surface. The carrier includes a second through hole, a release layer, an insulating paste layer and a metal layer. The insulating paste layer is disposed between the release layer and the metal layer. The carrier is attached to the second surface with the release layer thereof. The second through hole corresponds to the first through hole and penetrates the carrier for exposing the first through hole.


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