The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2017
Filed:
Mar. 10, 2014
Applicant:
Ibiden Co., Ltd., Ogaki-shi, JP;
Inventor:
Kosuke Ikeda, Ogaki, JP;
Assignee:
IBIDEN CO., LTD., Ogaki-shi, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 1/0296 (2013.01); H05K 1/0373 (2013.01); H05K 3/4644 (2013.01); H05K 3/4676 (2013.01); H05K 3/381 (2013.01); H05K 3/4682 (2013.01); Y10T 29/49117 (2015.01);
Abstract
A wiring board includes a core structure including a core substrate, and a buildup structure formed on the core structure and including an interlayer insulating layer and a conductive layer. The interlayer insulating layer does not contain inorganic fiber and includes a resin and an inorganic filler, and the conductive layer is formed on the interlayer insulating layer such that the inorganic filler in the interlayer insulating layer is not in contact with the conductive layer.