The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2017
Filed:
Aug. 30, 2015
International Business Machines Corporation, Armonk, NY (US);
Pooja R. Batra, White Plains, NY (US);
John W. Golz, Manassas, VA (US);
Subramanian S. Iyer, Mount Kisco, NY (US);
Douglas C. La Tulipe, Jr., Guilderland, NY (US);
Spyridon Skordas, Wappingers Falls, NY (US);
Kevin R. Winstel, East Greenbush, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The embodiments of the present invention relate generally to the fabrication of integrated circuits, and more particularly to a structure and method for fabricating a 3D integration scheme for multiple semiconductor wafers using an arrangement of intra-wafer through silicon vias (TSVs) to electrically connect the front side of a first integrated circuit (IC) chip to large back side wiring on the back side of the first IC chip and inter-wafer TSVs to electrically connect the first IC chip to a second IC chip.