The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2017

Filed:

Jun. 11, 2014
Applicant:

Kabushiki Kaisha Nihon Micronics, Tokyo, JP;

Inventors:

Tatsuo Inoue, Tokyo, JP;

Hidehiro Kiyofuji, Saitama, JP;

Osamu Arai, Tochigi, JP;

Assignee:

Kabushiki Kaisha Nihon Micronics, Musashino-shi, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/00 (2006.01); G01R 1/04 (2006.01); G01R 1/073 (2006.01); G01R 31/26 (2014.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 1/0416 (2013.01); G01R 1/07307 (2013.01); G01R 1/07342 (2013.01); G01R 31/26 (2013.01); G01R 31/2887 (2013.01);
Abstract

An apparatus includes a wiring base plate arranged on an upper side of a chuck top and having a wiring path connected to a tester, a probe card having a probe board spaced from the wiring base plate with a first surface thereof opposed to the wiring base plate and having a wiring path corresponding to the wiring path and probes provided on a second surface of the probe board to be connected to the wiring path and enabling to respectively contact connection pads of a semiconductor wafer on the chuck top, and an electric connector connecting the wiring base plate to the probe board by low heat conduction supporting members and decreasing heat conduction therebetween and electrically connecting the wiring paths.


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