The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2017

Filed:

Nov. 20, 2014
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Shakti Singh Chauhan, Guilderland, NY (US);

Kaustubh Ravindra Nagarkar, Clifton Park, NY (US);

Matthew Jeremiah Misner, Delanson, NY (US);

Faisal Razi Ahmad, Niskayuna, NY (US);

Assignee:

General Electric Company, Niskayuna, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 21/02 (2006.01); F28F 21/06 (2006.01);
U.S. Cl.
CPC ...
F28F 21/02 (2013.01); F28F 21/067 (2013.01); Y10T 428/249955 (2015.04); Y10T 428/249958 (2015.04); Y10T 428/249978 (2015.04);
Abstract

Composite foams are provided including a metal template and a conformal atomic-scale film disposed over such metal template to form a 3-dimensional interconnected structure. The metal template includes a plurality of sintered interconnects, having a plurality of first non-spherical pores, a first non-spherical porosity, and a first surface-area-to-volume ratio. The conformal atomic-scale film has a plurality of second non-spherical pores, a second non-spherical porosity, and a second surface-area-to-volume ratio approximately equal to the first surface-area-to-volume ratio. The plurality of sintered interconnects has a plurality of dendritic particles and the conformal atomic-scale film includes at least one of a layer of graphene and a layer of hexagonal boron nitride.


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