The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2016

Filed:

Nov. 30, 2010
Applicants:

Morgan C. Putnam, Pasadena, CA (US);

Michael D. Kelzenberg, Pasadena, CA (US);

Harry A. Atwater, South Pasadena, CA (US);

Shannon W. Boettcher, Eugene, OR (US);

Nathan S. Lewis, La Canada, CA (US);

Joshua M. Spurgeon, Pasadena, CA (US);

Daniel B. Turner-evans, Pasadena, CA (US);

Emily L. Warren, Pasadena, CA (US);

Inventors:

Morgan C. Putnam, Pasadena, CA (US);

Michael D. Kelzenberg, Pasadena, CA (US);

Harry A. Atwater, South Pasadena, CA (US);

Shannon W. Boettcher, Eugene, OR (US);

Nathan S. Lewis, La Canada, CA (US);

Joshua M. Spurgeon, Pasadena, CA (US);

Daniel B. Turner-Evans, Pasadena, CA (US);

Emily L. Warren, Pasadena, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0232 (2014.01); H01L 31/0236 (2006.01); H01L 31/052 (2014.01); H01L 31/0224 (2006.01); H01L 31/068 (2012.01); H01L 31/0352 (2006.01); H01L 31/18 (2006.01); H01L 31/056 (2014.01); H01L 31/054 (2014.01);
U.S. Cl.
CPC ...
H01L 31/035281 (2013.01); H01L 31/022425 (2013.01); H01L 31/056 (2014.12); H01L 31/0547 (2014.12); H01L 31/068 (2013.01); H01L 31/1804 (2013.01); Y02E 10/52 (2013.01); Y02E 10/547 (2013.01); Y02P 70/521 (2015.11);
Abstract

Three-dimensional patterning methods of a three-dimensional microstructure, such as a semiconductor wire array, are described, in conjunction with etching and/or deposition steps to pattern the three-dimensional microstructure.


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