The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2016

Filed:

Jan. 15, 2015
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Shu Qin, Boise, ID (US);

Yongjun Jeff Hu, Boise, ID (US);

Allen McTeer, Eagle, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 29/08 (2006.01); H01L 29/45 (2006.01); H01L 21/223 (2006.01); H01L 27/092 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0847 (2013.01); H01L 21/2236 (2013.01); H01L 27/092 (2013.01); H01L 29/456 (2013.01);
Abstract

Some embodiments include a device having an n-type diffusion region, and having a boron-doped region within the n-type diffusion region. The boron-doped region extends no deeper than about 10 nanometers from an upper surface of the n-type diffusion region. Some embodiments include a method in which first boron-enhanced regions are formed within upper portions of n-type source/drain regions of an NMOS (n-type metal-oxide-semiconductor) device and second boron-enhanced regions are simultaneously formed within upper portions of p-type source/drain regions of a PMOS (p-type metal-oxide-semiconductor) device. The first and second boron-enhanced regions extend to depths of less than or equal to about 10 nanometers.


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