The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2016

Filed:

Dec. 27, 2013
Applicant:

Shin-etsu Handotai Co., Ltd., Tokyo, JP;

Inventor:

Hiroshi Takeno, Gunma, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2014.01); H01L 21/66 (2006.01); G01R 33/48 (2006.01); G01R 1/00 (2006.01); G01R 3/00 (2006.01); G01R 33/565 (2006.01);
U.S. Cl.
CPC ...
H01L 22/14 (2013.01); G01R 31/2642 (2013.01); G01R 1/00 (2013.01); G01R 3/00 (2013.01); G01R 33/4828 (2013.01); G01R 33/56527 (2013.01);
Abstract

Provided is a method of measuring a recombination lifetime of a silicon substrate, which is capable of evaluating metal contamination and crystal defects in a silicon substrate manufacturing process and a device manufacturing process with high accuracy. The method includes: measuring a recombination lifetime of a silicon substrate after subjecting a surface of the silicon substrate to chemical passivation processing; and performing ultraviolet protection processing of protecting at least the silicon substrate from ultraviolet rays during a period from the chemical passivation processing to a time when the measurement of the recombination lifetime is completed.


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