The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2016

Filed:

Dec. 15, 2015
Applicant:

United Microelectronics Corp., Hsinchu, TW;

Inventors:

Yen-Ting Ho, Taipei, TW;

Sung-Bin Lin, Hsinchu, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G11C 16/16 (2006.01); G11C 16/14 (2006.01); G11C 16/04 (2006.01); H01L 29/792 (2006.01); H01L 29/423 (2006.01); G11C 16/10 (2006.01); H01L 29/51 (2006.01);
U.S. Cl.
CPC ...
G11C 16/14 (2013.01); G11C 16/0466 (2013.01); G11C 16/10 (2013.01); H01L 29/4234 (2013.01); H01L 29/42364 (2013.01); H01L 29/511 (2013.01); H01L 29/518 (2013.01); H01L 29/792 (2013.01);
Abstract

An operating method of a memory device includes providing the memory device and performing an erase operation. The memory device includes a substrate, a gate dielectric layer formed on the substrate, a gate conductive layer formed on the gate dielectric layer, a charge trapping layer, a charge blocking layer, a source region, and a drain region. The charge trapping layer has a vertical portion formed on a sidewall of the gate conductive layer and a horizontal portion formed between the substrate and the gate conductive layer. The charge blocking layer is formed between the substrate and the charge trapping layer. The source and drain regions are formed in the substrate and located at two sides of the gate conductive layer respectively. Performing the erase operation includes applying an erase voltage to the gate conductive layer for inducing a BBHH injection and a FN hole tunneling.


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